1/6 stps30l60cw/ct/cg/cr march 2001 - ed: 2b power schottky rectifier ? dual center tap schottky rectifiers suited for switched mode power supplies and high frequency dc to dc converters. packaged in to-220, d 2 pak, i 2 pak and to-247 this device is intended for use in high frequency inverters. description n negligible switching losses n low forward voltage drop n low thermal resistance features and benefits symbol parameter value unit v rrm repetitive peak reverse voltage 60 v i f(rms) rms forward current 30 a i f(av) average forward current tc = 130c d = 0.5 per diode per device 15 30 a i fsm surge non repetitive forward current tp = 10 ms sinusoidal 230 a i rrm repetitive peak reverse current tp=2 m s square f=1khz 2a t stg storage temperature range - 65 to + 175 c tj maximum operating junction temperature * 150 c dv/dt critical rate of rise of reverse voltage 10000 v/ m s absolute ratings (limiting values, per diode) i f(av) 2x15a v rrm 60 v tj (max) 150c v f (max) 0.56 v main product characteristics a1 k a2 to-247 stps30l60cw *: dptot dtj rth j a < - 1 () thermal runaway condition for a diode on its own heatsink a1 k a2 a1 a2 k to-220ab stps30l60ct a1 a2 k d 2 pak STPS30L60CG a1 a2 k i 2 pak stps30l60cr
stps30l60cw/ct/cg/cr 2/6 symbol parameter tests conditions min. typ. max. unit i r * reverse leakage current tj = 25c v r =v rrm 480 m a tj = 125c 77 130 ma v f * forward voltage drop tj = 25 ci f =15a 0.6 v tj = 125c i f =15a 0.5 0.56 tj=25 ci f =30a 0.75 tj = 125c i f =30a 0.65 0.7 pulse test : * tp = 380 m s, d <2% to evaluate the maximum conduction losses use the following equation : p=0.42xi f(av) + 0.009 i f 2 (rms) static electrical characteristics (per diode) symbol parameter value unit r th(j-c) junction to case per diode total 1.5 0.8 c/w r th(c) coupling 0.1 c/w thermal resistances 0 2 4 6 8 101214161820 0 2 4 6 8 10 12 pf(av)(w) t d =tp/t tp if(av) (a) d = 1 d = 0.5 d = 0.2 d = 0.1 d = 0.05 fig. 1: average forward power dissipation versus average forward current (per diode). 0 25 50 75 100 125 150 0 2 4 6 8 10 12 14 16 18 if(av)(a) rth(j-a)=15c/w rth(j-a)=rth(j-c) tamb(c) t d =tp/t tp fig. 2: average forward current versus ambient temperature( d = 0.5, per diode). when the diodes 1 and 2 are used simultaneously : d tj(diode 1) = p(diode1) x r th(j-c) (per diode) + p(diode 2) x r th(c)
stps30l60cw/ct/cg/cr 3/6 0 5 10 15 20 25 30 35 40 45 50 55 60 1e-2 1e-1 1e+0 1e+1 1e+2 5e+2 ir(ma) tj=125c tj=25c tj=150c tj=100c tj=75c tj=50c vr(v) fig. 5: reverse leakage current versus reverse voltage applied (typical values, per diode). 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 1 10 100 200 ifm(a) tj=25c tj=125c typical values tj=150c vfm(v) fig. 7: forward voltage drop versus forward current (maximum values, per diode). 1 10 100 0.1 0.2 0.5 1.0 2.0 c(nf) f=1mhz tj=25c vr(v) fig. 6: junction capacitance versus reverse voltage applied (typical values, per diode). 1e-4 1e-3 1e-2 1e-1 1e+0 0.0 0.2 0.4 0.6 0.8 1.0 zth(j-c)/rth(j-c) tp(s) single pulse d = 0.1 d = 0.2 d = 0.5 fig. 4: relative variation of thermal impedance junction to case versus pulse duration. 1e-3 1e-2 1e-1 1e+0 0 50 100 150 200 250 im(a) tc=25c tc=125c tc=75c t(s) i m t d =0.5 fig. 3: non repetitive surge peak forward current versus overload duration (maximum values, per diode). 0 4 8 12 16 20 24 28 32 36 40 0 10 20 30 40 50 60 70 80 s(cu) (cm2) rth(j-a) (c/w) fig. 8: thermal resistance junction to ambient ver- sus copper surface under tab for d 2 pak (epoxy printed circuit board fr4, copper thickness: 35m)
stps30l60cw/ct/cg/cr 4/6 package mechanical data d 2 pak a c2 d r a2 m v2 c a1 g l l3 l2 b b2 e * * flat zone no less than 2mm ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.017 0.024 c2 1.23 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.40 0.393 0.409 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.40 1.75 0.055 0.069 m 2.40 3.20 0.094 0.126 r 0.40 typ. 0.016 typ. v2 0 8 0 8 8.90 3.70 1.30 5.08 16.90 10.30 footprint
stps30l60cw/ct/cg/cr 5/6 package mechanical data to-220ab a c d l7 dia l5 l6 l9 l4 f h2 g g1 l2 f2 f1 e m ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 c 1.23 1.32 0.048 0.051 d 2.40 2.72 0.094 0.107 e 0.49 0.70 0.019 0.027 f 0.61 0.88 0.024 0.034 f1 1.14 1.70 0.044 0.066 f2 1.14 1.70 0.044 0.066 g 4.95 5.15 0.194 0.202 g1 2.40 2.70 0.094 0.106 h2 10 10.40 0.393 0.409 l2 16.4 typ. 0.645 typ. l4 13 14 0.511 0.551 l5 2.65 2.95 0.104 0.116 l6 15.25 15.75 0.600 0.620 l7 6.20 6.60 0.244 0.259 l9 3.50 3.93 0.137 0.154 m 2.6 typ. 0.102 typ. diam. 3.75 3.85 0.147 0.151 package mechanical data i 2 pak ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.49 2.69 0.098 0.106 b 0.70 0.93 0.028 0.037 b1 1.14 1.17 0.044 0.046 b2 1.14 1.17 0.044 0.046 c 0.45 0.60 0.018 0.024 c2 1.23 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e 10.0 10.4 0.394 0.409 l 13.1 13.6 0.516 0.535 l1 3.48 3.78 0.137 0.149 l2 1.27 1.40 0.050 0.055 e d l l1 l2 b1 b b2 e a c2 a1 c
6/6 stps30l60cw/ct/cg/cr information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap- proval of stmicroelectronics. the st logo is a registered trademark of stmicroelectronics ? 2001 stmicroelectronics - printed in italy - all rights reserved. stmicroelectronics group of companies australia - brazil - china - finland - france - germany - hong kong - india - italy - japan - malaysia malta - morocco - singapore - spain - sweden - switzerland - united kingdom - u.s.a. http://www.st.com n cooling method : c n recommended torque value : 0.8m.n n maximum torque value : 1.0m.n package mechanical data to-247 f2 f1 v2 l4 l2 l1 l3 d l l5 me h v v a dia. f3 f4 g = = f(x3) ref. dimensions millimeters inches min. typ. max. min. typ. max. a 4.85 5.15 0.191 0.203 d 2.20 2.60 0.086 0.102 e 0.40 0.80 0.015 0.031 f 1.00 1.40 0.039 0.055 f1 3.00 0.118 f2 2.00 0.078 f3 2.00 2.40 0.078 0.094 f4 3.00 3.40 0.118 0.133 g 10.90 0.429 h 15.45 15.75 0.608 0.620 l 19.85 20.15 0.781 0.793 l1 3.70 4.30 0.145 0.169 l2 18.50 0.728 l3 14.20 14.80 0.559 0.582 l4 34.60 1.362 l5 5.50 0.216 m 2.00 3.00 0.078 0.118 v5 5 v2 60 60 dia. 3.55 3.65 0.139 0.143 ordering type marking package weight base qty delivery mode stps30l60cw stps30l60cw to-247 4.4g 50 tube stps30l60ct stps30l60ct to-220ab 2.3g 50 tube STPS30L60CG STPS30L60CG d 2 pak 1.5g 50 tube stps30l60cr stps30l60cr i 2 pak 1.49 g 50 tube n epoxy meets ul94,v0
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